In this episode of Micro Journeys Inside Access, host Daniel Marrujo sits down with Jason Conrad, who leads Arizona State University's Southwest Advanced Prototyping Hub (SWAP Hub), to examine how the United States is working to rebuild its advanced semiconductor packaging capabilities. The conversation covers Conrad's path from a 23-year career in the semiconductor industry into standing up a national microelectronics initiative, the mechanics of the CHIPS Act and the Microelectronics Commons, and why advanced packaging — not just chip fabrication — is central to the future of AI, drones, and national defense.
The episode dives into a core challenge facing the domestic semiconductor ecosystem: how to reconnect research and manufacturing so that innovations developed in university and national labs can actually reach production at scale. Conrad explains the difference between traditional and advanced packaging, walks through the six technology focus areas driving the SWAP Hub's work, and lays out why closing the “lab-to-fab” gap matters for workforce development and long-term national security.
What You'll Discover in This Episode:
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