Northrop Grumman Program Manager Brittany Battaglia joins host Daniel Marrujo for a deep dive into the evolution of microelectronics manufacturing, advanced packaging, and the future of on-shore capability in the United States. Brittany shares her winding career path—from business studies and global supply chain into highly technical program leadership—and how her cross-functional experience uniquely positions her to support the needs of today’s rapidly accelerating defense and commercial markets.
In this episode, Brittany details the transformation occurring inside the Northrop Grumman Microelectronics Center (NGMC), the rollout of its open access model, and why packaging and secure on-shore manufacturing have become essential to national security and technological competitiveness. She explains how Northrop’s “FedEx Flow” streamlines historically fragmented processes across fabrication, bumping, dicing, assembly, and testing—reducing complexity, cost, and delays for customers across the defense industrial base and emerging commercial partners.
Ultimately, this conversation reveals how Northrop Grumman is tackling the bottlenecks in microelectronics with speed, state-of-the-art facilities, and a uniquely integrated ecosystem. Brittany outlines how NGMC’s approach delivers faster timelines, repeatable manufacturing, secure handling, and a single point of accountability—offering a scalable solution to one of the nation’s most pressing technology challenges.
What You’ll Discover in This Episode
0:45 — Brittany’s Path Into Microelectronics
How a business background, graduate studies, and early supply chain work positioned her for a cross-functional career at Northrop Grumman.
05:24 — The NGMC and the Future of Advanced Packaging
A breakdown of the capabilities inside Northrop’s Microelectronics Center and why packaging has become the “thumbprint-sized” powerhouse of modern systems.
11:20 — Why On-Shore Microelectronics Manufacturing Matters
Brittany explains the security, efficiency, and strategic advantages of domestic fabrication and packaging.
17:25 — Flexibility in Wafer Sizes and Materials
How Northrop works across 150–300mm wafers and multiple material systems to support both legacy and next-gen technologies.
23:06 — The “FedEx Flow”: Streamlining the Entire Product Lifecycle
Why Northrop Grumman is eliminating multi-vendor handoffs and offering customers a single point of contact from fab to test.
39:38 — Meeting Future Department of Defense Requirements
How NGMC’s commercial-like processes, internal investments, and partnerships are accelerating timelines and meeting emerging mission demands.
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